| 摘要 |
PURPOSE:To remove burr easily and to improve the productivity by irradiating the burr formed by transfer molding with a laser beam. CONSTITUTION:A semiconductor device 10 which is connected to leads 3 and is fixed on a heat dissipating plate 4 is resin-molded by transfer molding. At this time, burr 5 is formed in the part where the device is in contact with the molding resin 6 of leads 3 or the heat dissipating plate 4. The semiconductor device 10 in which the burr 5 is thus formed is put on an X-Y table 7 of a laser processing device. Then a laser beam is projected to the burr from its upper surface in a direction of the arrow A or B with moving the X-Y table 7. Consequently, the burr 5 is broken in a moment and evaporates to expose the planes of the leads 3 and the heat dissipating plate which were covered with the burr 5. |
