发明名称 METHOD OF PRODUCING INSULATING CASING FOR ELECTRONIC PART
摘要 To form the base part of the casing, a window is cut in a conducting plate leaving two tongues extending into the window whose ends 6a, 6'a are bent out of the plane of the plate. An insulating layer 8 is deposited on the plate, filling the window to form an insulating support 10 and embedding the bent ends 6a, 6'a of the tongues. The central portion of the plate is removed so as to leave only a frame 12. The roots of the tongues are also removed to separate the bent ends of forming through connections 6a, 6'a from the frame 12. The cover member is produced from a conducting plate on which a uniform insulating layer is deposited. The central part of the conducting plate is removed, so as to leave only a frame corresponding to the frame on the base member. After mounting a component, in particular a quartz resonator, on the support 10 and connecting to the through connections 6a, 6'a the cover is fitted e.g. by soldering the frames together. <IMAGE>
申请公布号 JPS5710514(A) 申请公布日期 1982.01.20
申请号 JP19810071498 申请日期 1981.05.14
申请人 EBAUCHESFABRIK ETA AG 发明人 PEETAA HOOFUAA
分类号 H01L21/822;G04F5/06;H01L23/50;H01L27/04;H03H3/007;H03H3/02;H03H9/05;H03H9/10 主分类号 H01L21/822
代理机构 代理人
主权项
地址