| 摘要 |
<p>PURPOSE:To decrease the gap between semiconductor chips, by a method wherein at the position opposite to the common electrode plate connected between a first semiconductor chip and a second semiconductor chip, a lead part is led out from the second semiconductor chip. CONSTITUTION:Insulating plates 8 and 9 are bonded onto a metal substrate 20, a common electrode plate 21 is bonded onto the insulating plate 8, and a first diode chip 1 is bonded thereonto. An anode electrode plate 22 is bonded onto the insulating plate 9, and a second diode chip 2 is bonded onto said anode electrode plate 22. Cathode terminals 13 and 14 are bonded to the cathodes of the respective diode chips 1 and 2, a cathode electrode plate 12 is bonded to the cathode terminal 13, and a lead part 12a is led out upwardly. To the cathode terminal 13, one end 21b of the common electrode plate 21 is bonded. A synthetic resin container 23 is put thereon from above and bonded to the metal substrate 20, and the end parts of the lead parts 21a, 12a and 22a of the respective electrode plates are horizontally bent.</p> |
