| 摘要 |
PURPOSE:To reduce the stress applied to both each of leads and a semiconductor element in the resin sealing process for an integrated circuit, by a method wherein when resin sealing dies are clamped, the die pad part is sunk by a given quantity by utilizing a strong resin-sealing press. CONSTITUTION:The numerals 12 and 13 represent the upper and lower dies for resin sealing, which have a projection 16 and a groove 17 for bending a suspended lead 3, together with an upper and lower cavities 18 and 19 for forming resin 9 for sealing, respectively. The width l of the projection 16 and the width L of the groove 17 are properly set so that no resin escpaes when resin sealing is carried out. The numerals 14 represent pressing rods to hold a frame part 2 of a lead frame 1 in order to prevent the lead frame 1, to which a semiconductor element 5 has been brazed from floating up to produce any vibration and positional deviation when the upper and lower dies 12 and 13 are being clamped, that is, when the suspended lead 3 is bent. After a die pad part 4 has been sunk by a given quantity by employing such an apparatus, resin is injected to complete resin sealing. |
