| 摘要 |
PURPOSE:To make it possible to miniaturize a chip by providing a plurality of bonding pads on the entire surface or back surface of the chip via a resilient insulating film or via a connecting material filled in the through holes in the chip. CONSTITUTION:In a semiconductor device 10 on which functional areas are provided, the bonding pads 121-1220 which are to be connected to lead frames and the like are formed on the entire surface or back surface of the chip 11. In the case, said pads are formed on the back surface of the chip, the through holes are provided in the chip 11, a conductive connecting member 13 is filled via the insulating layer 15, and an electrode terminal 14 on the surface is connected to pad metallic layers 13a, 16, and 17 on the back by said member 13. In the case the pads are formed on the surface, e.g., a polyimide layer 16 is formed, and the pad metallic layer 13 is connected to the chip via through holes in the layer 60. Thus, the pad area can be broadened, and the chip size can be miniaturized. Since bonding becomes easy, automation can be realized. |
