| 摘要 |
PURPOSE:To improve adhesion of a molding body in an element whose surface is covered by silicone resin by blending a specified amount of metallic salt of fatty acid containing a specified amount of metal as a mold releasing agent in the resin composition used for a low pressure molding method. CONSTITUTION:An element such as, e.g., a mesa type diode, photocoupler, and the like, wherein the surface of a chip 2 is covered by silicone resin 3 is sealed and molded by, e.g., epoxy resin 4 by the low pressure molding method. In the resin composition used for sealing material, are blended organic additive, inorganic filling agent, mold releasing agent, and the like, in addition to the resin component containing hardner. As the mold releasing agent, e.g., 0.5-1.5wt% of zinc stearate including 0.1-0.25wt% of metal component is blended and used with respect to the organic component of the composition. In this constitution, adhesion at the boundary between the silicone resin 3 and the sealing part 4 can be improved, and the moisture resistance of the sealed part can be improved. |
