| 摘要 |
PURPOSE:To reduce the number of points where bonding wire connection are necessary and reduce the producing cost and improve the reliability by a method wherein a magnetic resistance element and a semiconductor circuit are formed individually on a same semiconductor substrate and the electrodes of the magnetic resistance element and the electrodes of the semiconductor circuit are mutually connected with metal film conductors. CONSTITUTION:An integrated circuit element 1, which is necessary for a magnetic sensor, is formed on a part of a silicon substrate. After a nickel-iron film and a gold film are successively formed over the wafer in a same vacuum, a magnetic resistance element 2 is formed by etching with precision processing technology including photolithography technology. Then a chromium-gold film is formed by vacuum evaporation and metal film conductors 3 are formed by photolithography technology and precision processing technology to make connections between respective electrodes. This magnetic sensor element is stuck on lead terminals 5 with epoxy resin or the like and source, output and grounding electrodes 6 for connection with external leads and the lead terminals 5 are connected together with bonding wires.
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