发明名称 Laser machining apparatus
摘要 PCT No. PCT/JP83/00441 Sec. 371 Date Aug. 17, 1984 Sec. 102(e) Date Aug. 17, 1984 PCT Filed Dec. 17, 1983 PCT Pub. No. WO84/02296 PCT Pub. Date Jun. 21, 1984.This invention relates to improvement in a laser machining apparatus using both a working laser generator (101) and an auxiliary energy supplying apparatus (110) such as a plasma or the like. A feature of the invention is that an auxiliary energy generated from the auxiliary energy supplying apparatus is radiated on a workpiece (118) to a location which is slightly apart from an irradiation point of a working laser beam. In a preferred embodiment, the auxiliary energy supplying apparatus (110) is attached to a rotary disk (113) thereby allowing the auxiliary energy to be radiated to a location which is always preceding an irradiation point of the laser beam in the working progressing direction. The auxiliary energy may be radiated onto a surface opposite to the surface of a workpiece to which the laser beam is radiated. With such an arrangement, working efficiency and accuracy are improved and a structure of the whole system is also simplified, resulting in less failure. To further improve the working efficiency, in a desirable embodiment, an abrasive grain may be supplied to the working portion, or a high-pressure working fluid may be jetted thereto, or a working fluid to which an ultrasonic vibrational energy was applied may be supplied thereto. Further, a focal point automatic adjusting mechanism of the laser beam may be provided.
申请公布号 US4689467(A) 申请公布日期 1987.08.25
申请号 US19840641979 申请日期 1984.08.17
申请人 INOUE-JAPAX RESEARCH INCORPORATED 发明人 INOUE, KIYOSHI
分类号 B23K10/00;B23K26/12;B23K26/14;B23K26/36;B23K28/02;(IPC1-7):B23K26/00 主分类号 B23K10/00
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