| 摘要 |
PURPOSE:To prevent the junction of a solar cell from damaging by flattening the electrode forming portion of the cell in which a photodetecting surface is rough. CONSTITUTION:An etching resist 2 is formed by printing in coincidence with a texture-etching surface electrode pattern with a P-type silicon substrate 1, and mirror-etched to form a flat surface. After an N<+> type layer 3 is formed by diffusing POCl8 to form a P-N junction J1, aluminum paste is printed on the back surface, a P-P' junction J2 is formed by heat treating at 700 deg.C for 5 min to obtain an N'-P-P' junction configuration. Front and back surface electrodes 5, 6 are formed by printing Ga paste and heat treating and solder 7 is dipped to form a solar cell. |
