| 摘要 |
PURPOSE:To flatly form the surface of a film for insulating between layers of an LSI or the like by applying ultrasonic vibration to a substrate coated with liquid- state resin film, then rotating the substrate and removing the interposed foams. CONSTITUTION:A vacuum chuck is used to mount a substrate 18 on a disk 11, and liquid resin, e.g., polyladderoxysiloxane resin is dropped and coated on the substrate. Then, high frequency output is applied to a vibrator 16, the ultrasonic vibration is transmitted via an arm 15 to a stainless steel plate 14, and the substrate 18 on the disk 11 is vibrated. The resin is introduced into the recess of the substrate by this vibration, and the foams in the resin is floated on the surface. Then, the disk 11 is rotated by the motor 13, the surface layer of the resin is removed, and the surface is flattened. Thereafter, the coating, vibrating and rotating steps are repeated, and a thick resin film can be flattened. Thus, no problem, e.g., disconnection of the wiring layer occurs on the wiring layer formed on the resin film. |
