| 摘要 |
PURPOSE:To prevent the cracking of a substrate due to a temperature cycle test and the lowering of dielectric strength by dividing the ceramic substrate into several parts. CONSTITUTION:The substrate 2 is divided into a main substrate 21 and sub substrates 22 and 23. A transistor 8 and a diode 9 are mounted on the main substrate 21 and an emitter electrode 5 is soldered on the sub substrate 22. A base terminal 3 and a common terminal 6 are soldered on the sub substrate 23. A thick film interconnection is applied on the surface of the respective substrates. With such an arrangement, a simple technique, dividing an insulating plate bonded on a radiation plate 1, can prevent the lowering of the dielectric strength due to cracking of the substrate in a temperature cycle test thereby improving the reliability of the device. |
