| 摘要 |
PURPOSE:To enable a very thin workpiece to be high accurately polished, by manufacturing a carrier, which holds the workpiece, using a specific material. CONSTITUTION:A carrier 1 is manufactured by a material in which the carrier can be polished or lapped simultaneously with a workpiece. When the workpiece is made by, for instance, a silicone substrate, this carrier 1 is manufactured by aluminum having a quality in which it is damaged even by acid and also alkaline similarly to silicone. The carrier 1, manufactured as above, holds the workpiece, and is polished simultaneously with the carrier 1 thus obtaining the workpiece high accurately polished in a minimum thickness permitted for the carrier 1. |
