| 摘要 |
PURPOSE:To eliminate the actual position detections of leads at each time, to accordingly shorten the manufacturing time of a semiconductor device product, and to improve the productivity by automatically wire bonding lead units on the basis of the value of position change confirmed by the heating experiment of a sample lead frame. CONSTITUTION:One lead frame 12 is fed to a bonding stage by a plurality of constant pitch feedings, and wire bonded while it is being heated. In such a wire bonding method, lead units 15-19 disposed in a bonding range by one feeding are fed to the bonding stage by a constant pitch feeding, and positional changes DELTAl11-DELTAl14 due to the thermal deformation of the lead positions with respect to the reference point 23 of the bonding stages of the units 15-19 are confirmed by the heating experiment of a sample lead frame. The units 15-19 are automatically wire bonded on the basis of the changes DELTAl11-DELTAl14 confirmed by the sample lead frame. |
