| 摘要 |
PURPOSE:To improve the reliability of a wire bonding by forming a hole for exposing a part of a wiring layer at a predetermined position of an insulating film covered on the wiring layer, and wire bonding the bonding pad of a semiconductor pellet to the wiring layer of the hole. CONSTITUTION:A wiring layer 3 disposed on the periphery of a semiconductor pellet bonded to a package substrate 1 is covered with an insulating film 4, and a hole 13 for exposing a part of the layer 3 is formed on each layer 3 at a predetermined position of the film 4. The bonding pad 12 of the mounted pellet 5 is wire bonded to a lead exposed in the hole 13. Accordingly, since the layer 3 can be exposed in a width necessary for wire bonding and the other part covered, it Can prevent both from being contacted with one another even when the wire 5 is disposed across the adjacent layer 3. Thus, since it can prevent both from being shortcircuited, its electric reliability can be improved. |
