| 摘要 |
PURPOSE:To make it possible to effectively identify whether the product is acceptable or rejectable in an inspection of a defective component by dividing the power wirings of a semiconductor chip into a plurality, and connecting leads through bonding wirings to each divided power wire. CONSTITUTION:Power wirings 7 (7A, 7B) of a semiconductor chip 2 are divided into a plurality, and leads 3B (3Ba) is connected through a bonding wire 4 to each divided power wire 7. Accordingly, when a connecting malfunction or disconnection occurs at the wire 4, power cannot be supplied to a circuit connected to the divided wire 7. Thus, the circuit does not operate. In other words, the connecting malfunction of the wire 4 can be effectively identified whether the circuit operates or not. Thus, whether a resin-sealed semiconductor device 1 is acceptable or not can be effectively identified in the inspection of the defective component. |
