ELECTRONIC DEVICE AND ITS CHIP AND ITS SUBSTRATE

摘要

PURPOSE:To enable high-precision assembling, by making concentric arrangement of a chip's electrode and an electrode part of a substrate facing this chip. CONSTITUTION:A ring-shaped insulating layer 7 is formed on the main surface part of a stem 1 surrounding a point electrode 6 and a ringshaped electrode 8 is formed on the main surface of the insulating layer 7. This ring-shaped electrode 8 is arranged concentric to the point electrode 6 and made to overlap with a ring-shaped anode electrode 5 of a light emitting diode chip 2. Therefore, when facedown bonding of the light emitting diode chip is performed on the stem, it becomes unnecessary to modify the light emitting diode chip in the direction of its rotation and it becomes necessary to modify the position of the chip only in the X-Y flat direction. Thus, a position alignment is easily done and a bonding work is facilitated so that a high-precision facedown bonding can be performed.