| 摘要 |
PURPOSE:To readily manufacture a thin film diode and to enhance the reliability and performance of the diode by sequentially laminating a Cd layer, a Te layer and the second electrode layer on the first electrode of an insulating substrate. CONSTITUTION:The first electrode layer 2 of desired shape is formed on a substrate 1 of glass or glazed ceramic or the like. Then, a CdS film 3 is formed by vacuum deposition process or sputtering method or the like. Thereafter, a Te film 4 is formed by vacuum deposition process or sputtering method on the surface formed with the film 3, and a Te layer 4 and a conductive film 5 are further formed thereon by vacuum deposition process or sputtering method or the like. The film 5 forms the second electrode layer. |
