发明名称 Hot melt adhesive compositions
摘要 This invention relates to hot melt adhesive compositions which includes a neutralized sulfonated polystyrene resin wherein the neutralized sulfonated polystyrene resin has about 5 to about 250 meq. of neutralized sulfonate groups per 100 grams of the neutralized sulfonated polystyrene resin and about 25 to about 250 parts by weight of a hydrocarbon resin of a petroleum or coal tar distillate, aliphatic dienes and mono and diolefins, cyclic olefins of 5 or 6 carbon atoms and hydrogenated poly cyclics per 100 parts by weight of the neutralized sulfonated polystyrene resin. Additionally, an unsaturated hydrocarbon polymer such as polyisoprene and polybutadiene can be incorporated into the adhesive compositions.
申请公布号 US4310457(A) 申请公布日期 1982.01.12
申请号 US19800196210 申请日期 1980.10.14
申请人 EXXON RESEARCH & ENGINEERING CO. 发明人 AGARWAL, PAWAN K.;MAKOWSKI, DECEASED, HENRY S.
分类号 C09J109/00;C09J125/18;(IPC1-7):C08L91/00 主分类号 C09J109/00
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