| 摘要 |
PURPOSE:To stabilize the output of a semiconductor laser device and to enhance the reliability of the device by providing a heat absorbing member which does not dissipate heat at both electrode sides of the laser. CONSTITUTION:An array laser 1 is secured to a laser mount 5 together with a spacer 6 having the same height as the array laser. A cooler 7 is secured across the laser 1 and the spacer 6, the heat from the laser 1 is removed by the cooler 7, and the laser 1 is thus cooled. A heat sensitive element 8 is mounted at the side edge of the laser 1, and when the laser 1 becomes the prescribed temperature, the cooler 7 is operated, and the array laser 1 is thus cooled. |
