| 摘要 |
PURPOSE:To easily perform the attraction and detachment of the element by a method wherein the semiconductor element adhered on a sheet is attracted and detached by an attracting collet and the element is moved to the lead frame which was heated up by a heater and the collet is cooled while it is being moved to repeat the same movement to pick up the following element. CONSTITUTION:A plurality of semiconductor elements 5 are adhered on the sheet 4 and each of which is pushed up from the bottom, the collet 6 is thrusted up, the attracting collet 3 provided at the lower part of a die-bonding device head 2 is contacted to the pushed-up element and the element 5 is attracted and detached from the sheet 4. Then, the head 2 is shifted, the element 5 transferred to the lead frame 8 located on the platen 9 having a built-in heater 7 and a die-bonding is performed as prescribed. The movement of work is repeated as above-mentioned, and as the collet 3 is heate up by the heater 7, it increases the adhesive strength of the element 5 to be attracted and detached subsequently. Therefore, the collet 3 is passed over a cooling device 10, which is belowing out cooling air 11, on its way back to the sheet 4 and the collet 3 is cooled, thereby enabling to continue the work smoothly. |
