发明名称 HEAT INSULATION WALL
摘要 PURPOSE:To produce a heat insulation wall with decreased thermal conductivity and improved heat insulation properties, by foaming a foamable heat insulation material comprising a specific benzylic ether-type liq. phenolic resin compsn. integrally with a surfacing material comprising an ABS resin. CONSTITUTION:A heat insulation wall is produced by foaming a foamable heat insulation material comprising a mixture of a benzylic ether-type liq. phenolic resin compsn., 10-15wt.% (based on the resin compsn.) polyethers prepd. using a non-amine active hydrogen compound as the initiator, a catalyst, a cell stabilizer and an org. polyisocyanate, integrally with a surfacing material comprising an ABS resin. The foamable heat insulation material adheres very well to and chemically attacks slightly the surfacing material during the integral foaming, and does not cause whitening, cracks and delamination in the surfacing material even after a long-time use, thus enabling a significant quality improvement.
申请公布号 JPH01318048(A) 申请公布日期 1989.12.22
申请号 JP19880150772 申请日期 1988.06.17
申请人 MATSUSHITA REFRIG CO LTD 发明人 UEKADO KAZUTO;KATAOKA JINKO;NAKAMOTO HIDEO
分类号 F25D23/08;B29C39/10;B29K105/04;B29L31/00;C08G18/48;C08G18/54;C08J9/04;C08J9/14;C08L75/04 主分类号 F25D23/08
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