发明名称 SEALING METHOD FOR RESIN OF LIGHT EMITTING DIODE
摘要 PURPOSE:To sealing a light emitting diode with high reliability by employing specific ultraviolet curable low viscosity resin composition. CONSTITUTION:Triallyl isocyanurate, polychiol series are selected as ultraviolet curable resin, an LED is sealed by method, e.g., potting, casting, dipping dropping and the like with resin composition to which a light strating agent, a heat discoloration preventive agent, coloring agent are added to the composition, and is then ultraviolet rays are emitted to cure the resin. Since the triallyl isocyanurate, polychoil series as ultraviolet ray curable resins are very low viscosity liquid, the workability in the potting, casting and the like is preferable, and defoaming operation can be further facilitated.
申请公布号 JPS572583(A) 申请公布日期 1982.01.07
申请号 JP19800076661 申请日期 1980.06.09
申请人 SUMITOMO BAKELITE CO 发明人 SUZUKI SETSUO;TANIMOTO SHINICHI;MORISHITA KOUJI
分类号 H01L23/29;H01L23/31;H01L33/56 主分类号 H01L23/29
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