| 摘要 |
PURPOSE:To prevent the dripping of developing solution from a nozzle to a resist surface as well as to improve the uniformity of the developing in a spray type developing device by a method wherein a nozzle is provided at the lower section of the surface where resist is applied and the developing solution is vaporized. CONSTITUTION:In the spray type developing device, a wafer 2 is fixed on the supporting stand 1 of the device in such manner that the face 2, whereon a resist layer 3 was applied, is facing downward. A nozzle 5 is provided at the lower part of the device facing the resist layer 3 and the developing of the resist layer 3 is performed by spraying a developing solution 4 from the nozzle 5. The number of nozzle 5, to be provided in the device, may be increased to the plural. Through these procedures, the over-developing caused by dripping of the developing solution on the resist layer 3 from the nozzle 5 can be prevented, thereby enabling to improve the uniformity of developing. |
