发明名称 PRODUCTION OF THERMOSETTING RESIN LAMINATE
摘要 PURPOSE:To obtain a laminate outstanding in dielectric constant, heat resistance and electrical insulation, by using a resin composition prepared by blending a carboxyl group-terminated 1,4-polybutadiene, polymaleimide and phenolic antioxidant in an inert solvent. CONSTITUTION:First, a resin composition is prepared by blending, in an inert solvent, (A) a carboxyl group-terminated 1,4-polybutadiene with a number- average molecular weight <=10,000, (B) a polymaleimide of formula (R1 is a- valent 2C organic group; a is 2-10) (pref. N,N'-P,P'-diphenylmethane bismaleimide) and (C) 0.01-3wt.% (based on the total amount of the components A, B and C) of a phenolic antioxidant [pref., 2,2'-methylenebis(4-methyl-6-t- butylphenol)], preferably, by preliminary reaction between the components A and B followed by incorporation of the component C, thence, a substrate is impregnated with this resin composition to form a prepreg; specified number of sheets of which are laminated and, furthermore, if needed, a copper foil is laid thereon followed by pressing while heating to effect curing, thus obtaining the objective laminate.
申请公布号 JPS63258937(A) 申请公布日期 1988.10.26
申请号 JP19860238649 申请日期 1986.10.07
申请人 HITACHI CHEM CO LTD 发明人 FUJIOKA ATSUSHI;MIYADERA YASUO;HIROZAWA KIYOSHI
分类号 B29C43/20;B29K55/00;B29K105/06;B29L9/00;B32B5/28;B32B15/08;B32B27/04;C08J5/24;H05K1/03 主分类号 B29C43/20
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