| 摘要 |
PURPOSE:To prevent shoft-circuit, etc., to be caused by unequality of the shape of loops when a wire is to be bonded to a substrate by a method wherein a wire draw out preventing clamp to apply tension to the wire is made as movable upward and downward, and is linked to the ascent and descent motion of a capillary forming loops of the wire. CONSTITUTION:The draw out preventing clamp 19 is connected to a pull cut clamp 22 through a spring 28, and is fitted up as movable upward and downward being linked to the ascent and descent motion of the capillary 23 making a pin 21 provided at the wire supplying part as a fulcrum. After the capillary 23 is made to descend on the first point 12 of the substrate 29 and a ball 30 at the tip of the wire 1 is bonded, a ball draw up clamp 24 is opened, and the capillary ascends up to the height corresponding to the length of the wire 1 needed to form the necessary loop. Then, the capillary descends on the second point 15, and the wire 1 being formed the loop is bonded. Drawing out of tail quantity, cutting and formation of the ball 30 are performed in succession, and watch and wait for the next bonding. Accordingly because tension is not applied to the wire 1 when the capillary descends on the second point, the loop can be formed in the desired shape, and short-circuit, etc., can be prevented. |
