| 摘要 |
<p>An integrated circuit assembly comprises a circuit board one surface of which is provided with a circuit by an etching process. An integrated circuit chip 2 is disposed adjacent to this surface and is mounted between through- holes 1a, 1b in the circuit board 1. Wires 3 are wire bonded to electrodes of the integrated circuit chip 2 and the said circuit to effect electrical connections therebetween. The through-holes 1a, 1b are employed as gates in a transfer moulding process in which there is formed a moulded member 4 between which and the circuit board 1 the integrated circuit chip 2 is encapsulated. Portions of the moulded member 4 extend through the through-holes 1a, 1b and have enlarged parts 4a, 4b which overlie the opposite surface of the circuit board 1 to prevent removal of the moulded members 4 from the circuit board 1. <IMAGE></p> |
