发明名称 |
Colloidal compositions for electroless deposition stabilized by thiourea |
摘要 |
Metallic surfaces are imparted to non-conductors or dielectric substrates by electroless (chemical) plating process comprised of coating the substrates with colloid(s) of non-precious metals and wherein the colloids are prepared in a manner as to impart resistance towards further deterioration.
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申请公布号 |
US4309454(A) |
申请公布日期 |
1982.01.05 |
申请号 |
US19800137246 |
申请日期 |
1980.04.04 |
申请人 |
FELDSTEIN, NATHAN |
发明人 |
FELDSTEIN, NATHAN |
分类号 |
C23C18/28;H05K1/03;H05K3/18;(IPC1-7):C23C3/02 |
主分类号 |
C23C18/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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