METHODS FOR MANUFACTURING MICROMINIATURE SOLID STATE DEVICES AND APPARATUS FOR USE IN SUCH METHODS

摘要

A method for manufacturing microminiature solid state devices and apparatus for use in such a method. In various operations, e.g. wire-bonding and die-bonding it is essential to accurately orientate a header of the device. The header (1a) is mounted in a carrier strip (2) and is transported with approximately the desired orientation into the work area (6). Previous mechanical orientation techniques have caused both bending of the lead pins and adhesion between the header and the mechanical elements of the bonding machine. In this method, which is suitable for orientating devices with e.g. a T0.3, T0.5, T0.9 or T0.18 outline, magnetic attraction is used to pull two lead pins (12) against an abutment (14a) so that it becomes correctly orientated. The use of an electromagnet (7), which may be cooled using e.g. a nitrogen jet (17) or a water-cooling jacket (23), facilitates a periodic polarity reversal thus preventing any undesirable permanent magnetization.