发明名称 TAPE CARRIER SUBSTRATE FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent the deformation due to the change in the quality of material in the manufacturing process of the substrate as well as to improve the yield rate for the subject substrate by a method wherein a rolled bronze foil, containing a prescribed quantity of Sn, is used as a conductive metal layer to be used for lamination of a flexible insulating film. CONSTITUTION:As a material for a tape carrier substrate, the polyimide film 2 whereon a rolled bronze foil 3 containing Sn having thickness of 30mum or so is laminated, is used. The Sn content in the bronze foil is to be in the range of 0.05- 0.15wt%. Due to the additioning of the Sn, the strength of the conductive metal layer is increased as compared with pure copper and the quality of the material is stabilized due to the increased temperature of annealing. As a result, the deformation of the conductor layer due to the passing of a roller 1 in the manufacturing process of the substrate and the softening of the conductor layer 3 due to a heat treatment can be prevented. Also, the yielding rate can be improved, because of the improvement in the bonding property of the Sn plated layer.
申请公布号 JPS56167357(A) 申请公布日期 1981.12.23
申请号 JP19800071203 申请日期 1980.05.27
申请人 SHARP KK 发明人 HAYAKAWA MASAO;MAEDA TAKAMICHI;SENKAWA YASUNORI;KUMURA MASAO
分类号 H01L21/60;H01L21/48 主分类号 H01L21/60
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