| 摘要 |
PURPOSE:To provide a protective coating which is tough against mechanical impact, shows a vivid contrast in color with a pad and has an alpha rays check effect, by providing the surface of a semiconductor chip with a coating of polyimide layer having Si atom in its molecular structure. CONSTITUTION:In an Si substrate 1 in which active elements are formed, on the entire surface excluding a ponding pad section 5 composed of an aluminum layer 4 and a dicing line region 6, an ordinary protective coating 7, such as a PSG coating, etc., is formed. On this protective coating 7, a composite layer 8 is formed by a mixture of polyimide containing chemically combined Si atom and polyimide free from Si, and the substrate 1 is covered with this coating. Further, as required, an Si-free polyimide layer 9 is formed thick (approximately 10-30mum) on the top of the polyimide mixture layer 8. As it is possible, by doing so, to alleviate mechanical impact at the time of bonding and increase color contrast, work efficiency can be improved. Further, it is also possible to prevent alpha rays soft error by the thick polyimide layer. |
