| 摘要 |
PURPOSE:To increase the adhesion between a bonding pad and a bump, or a gold ball in a wire bonding, by make the area of the metal wiring layer of the lower layer smaller than that of the metal wiring layer of the uppermost layer constituting the bonding pad thereby forming a step in the pad. CONSTITUTION:A first metal wiring layer 10 is made shorter than a second metal wiring layer 12 toward the inside of the semiconductor device. By this, a step is formed in a pad opening 13. Further, to prevent the first metal wiring layer 10 and an insulation film 5 of the second metal wiring layer from being destroyed when a probe card is brought in contact with them, the first metal wiring layer 10 and the second metal wiring layer 12 are connected using a hole 11. Consequently, the surface area with which the gold ball in a wire bonding or the bump contacts increases as much as the step, and thus it can be effectively large. In addition, the stylus of the probe card does not slide, and a sufficient stylus pressure can be applied to prevent poor contact. |
