CERAMIC PLATE FOR GRINDING SEMICONDUCTOR WAFER

摘要

PURPOSE:To provide a ceramic plate for grinding semiconductor wafers which is not required to be abandoned nor exchanged even when bar codes become unreadable due to contamination or damage of a bar code printing surface. CONSTITUTION:Since a long rectangular recessed section 2 is provided on the surface of a plate main body 1 with an opening edge 2a which is inclined toward the center of the section 2 and a bar code carrying plate on which a bar codes plate 4 is coated with a coating body 3 made of a transparent resin having a corrosion and heat resistances is put in the section 2 in a removable state against the elasticity of projections 6 formed on the peripheral part of the coating body 3, the bar code carrying plate can be removed from the plate main body 1 after using the plate and no acid nor alkaline solution is left at the plate 5 mounting section after the plate 5 is removed.