| 摘要 |
PURPOSE:To increase the cooling effect and to make flat the frequency characteristic, by preventing thermal deformation, through the forming of a diaphragm plate with materials mixing metallic powder or fiber greater in heat conductivity to aromatic polyimide resin. CONSTITUTION:In a solution of aromatic polyimide resin with heat resistant and greater inner loss, after metallic powder such as aluminum, alumina, magnesium, and beryllium having greater heat conductivity is scattered and mixed, film with semicuring state 50mu thick by the dry solution method is obtained, or after coating aromatic polyimide resin on the both sides of alumina fiber, zirconia fiber, or tungusten fiber, film in semicuring state 50mu thick is produced through rollers. Further, this film is pressed for about one minute in heated metallic molds for curing. |
