发明名称 LEAD FRAME AND MANUFACTURE THEREOF
摘要 PURPOSE:To lower manufacturing cost by making it possible to reduce in size and to facilitate manufacturing process, by arranging plural pieces of leads in radial configuration centering position of a pad, arranging pins on the circumference, and manufactuing a product by punching process using a metallic mold of the same shape. CONSTITUTION:A lead frame is to take such a shape that plural leads extend in a radial configuration from a pad section 17, which is for being loaded with a chip and located on the center, toward a shortcircuit section 16, and outside of this, pins 13 are arranged toward a connecting section 15. In order to manufacture this, after punching a pilot hole 12 at process I, at process II, a punch-out section 14a between the leads 14 and a punch-out section 13a between the pins 13 are punched out in the position determined by the hole 12, by 6 sets of punching molds provided in the position set at 60 deg., respectively, in a radial configuration. Others are manufactured in turn by the metallic mold of the same shape by shifting positioning angle, and the lead frame is thus prepared. As it is possible, by doing so, to simplify shape of a product, it becomes possible to reduce in size of the product, and further since a metallic mold of the same shape is used, it is possible to facilitate process control and to lower the production cost.
申请公布号 JPS56164565(A) 申请公布日期 1981.12.17
申请号 JP19800069147 申请日期 1980.05.22
申请人 发明人
分类号 H01L23/50;H01L23/495 主分类号 H01L23/50
代理机构 代理人
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