发明名称 |
Circuit board with two-layer track - has thin upper surface protective portions and has anti-solder lacquer film on conductive tracks |
摘要 |
<p>The circuit board is pref. of the type with conductive tracks on both sides. It has a corrosion protection and/or etching resistance cover in the form of a top layer film. Parts of both surfaces are coated with a solder-resistant lacquer. The top layer portions are much thinner than the conventionally galvanically applied layers. The circuit board parts with such surface arrangement are coated with the solder-resistant lacquer (5). Pref. the thin top layer portions are of material which becomes liquid at a temperature lower than tin on the underlayer. This top layer portion material may tend less to edge breakage at the etching edges than tin. It may be typically a lead-tin alloy. The profile of the top layer portions may surround the underlayer on three sides.</p> |
申请公布号 |
DE3022757(A1) |
申请公布日期 |
1981.12.17 |
申请号 |
DE19803022757 |
申请日期 |
1980.06.13 |
申请人 |
LICENTIA PATENT-VERWALTUNGS-GMBH |
发明人 |
BUSCH,KLAUS-MICHAEL |
分类号 |
H05K3/06;H05K3/28;H05K3/34;H05K3/38;(IPC1-7):05K3/24 |
主分类号 |
H05K3/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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