发明名称 TRANSFERRING AND DISTRIBUTING METHOD
摘要 <p>PURPOSE:To make a series of operation processes automatic and permit an all-night unmanned operation by combining horizontal heating ovens used for diffusion, CVD and annealing process and a control operating part which loads and unloads semiconductor wafers. CONSTITUTION:For example, three horizontal heating ovens used for diffusion, CVD and annealing process are piled up to form a treating apparatus 4. A controlling apparatus 1 including a computer is disposed on one side thereof. A plurality of cassettes 2 containing a plurality of piled semiconductor wafers 3 are mounted on said controlling apparatus 1. First, several wafers 3 in the cassette 2 are vertically placed together on a pitch-changing large case 14 by using an air bearing 13. Then, by using a wafer chuck 21, the case 14 is successively loaded into cylinders CY12- CY14 of the respective heating ovens 4A-4C which are opened in the side surface of the apparatus 4. After given treatments have been finished, the operations are reversed to unload the case 14, which is returned onto the table of the controlling apparatus 1. Thereby, the operation processes are made full automatic, and the number of the necessary operators is reduced.</p>
申请公布号 JPS56164522(A) 申请公布日期 1981.12.17
申请号 JP19800068098 申请日期 1980.05.22
申请人 发明人
分类号 H01L21/677;B23Q41/00;B65G1/00;B65G1/133;B65G1/137;B65G49/00;G05B19/418;H01L21/02;H01L21/205;H01L21/22 主分类号 H01L21/677
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