发明名称 MANUFACTURE OF GLASS MOLD TYPE SEMICONDUCTOR DEVICE
摘要 PURPOSE:To reduce a difference in temperature between the upper and lower trays and to improve element characteristics by placing a plurality of pellets wherein trays carried into a furnace for baking glass are stacked in a multistage and a heat shielding plate is provided on the upper part of the trays. CONSTITUTION:Slurry passivation glass 4 is applied to subassemblies 7 blazing electrodes having lead wires 2a, 2b on pellets 1 and the subassemblies 7 are baked in a furnace providing a heater at all directions for glass sealing. Trays 6a-6h placing a plurality of the subassemblies 7 and carried into the furnace by a coveyor belt are stacked in a multistage and a heat-shielding plate 11 of stainless steel is mounted on the tray 6h placed at the utmost upper stage. In this way, radiant heat from the upper heater is isolated and no difference in temperature between the upper and lower trays will occur. In this way, the invasion of air bubbles to glass can be prevented and the withstand voltage characteristics and radiant heat property can be improved.
申请公布号 JPS56164541(A) 申请公布日期 1981.12.17
申请号 JP19800066492 申请日期 1980.05.21
申请人 发明人
分类号 H01L21/56;(IPC1-7):01L21/56 主分类号 H01L21/56
代理机构 代理人
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