| 摘要 |
PURPOSE:To judge and indicate the quality of bonding and to permit the automatization of inspection by detecting the marks of molten metal or protruded silver paste shown around a pellet by light reflection. CONSTITUTION:If a result is good, a sample 1 bonding a chip 3 on the tab 2 of a lead frame shows the marks of molten metal (or protruded silver paste section) 9 in all surroundigs. The sample 1 is placed on a semple base 4 and the amount of light reflection is measured and detected in each axis direction by a detector 6 movable in the X-axis and Y-axis direction. For example, if the marks 9 of molten metal exist, the amount of light reflection becomes small comparing with a metal plating surface 5 or a chip surface. The detected result is fed to a computer 7 and compared with previously memorized data and the sample detected the marks of molten metal 5 at least at three surroundings is indicated a a good one. In this way, inspection is simplified and automatization becomes possible. |
