Hybrid integrated circuit chip - has multilayer housing, whose metal connecting surfaces are soldered to thin sheet metal strips soldered to support surfaces

摘要

The chip carries an integrated circuit formed in a layer technique. Both main surfaces of the insulating planar support body are provided with conductive track pattern and with layered components and/or discrete components. It has a multi-layer housing containing an integrated circuit chip. The housing (2) is soldered via its metal connecting surfaces (22) to thin sheet metal strip (3). The latter are soldered to metal layer surfaces (4) on one main surface (11) of the support body (1). The strips are bent over the narrow surfaces (13) of the support body up to the metal layer surfaces on the opposite main surface (12) of the support body, where they are soldered. Pref. the housing is fitted in a corner of the support body, and two rows of its metal connecting surfaces are coupled to the opposite main surface by the sheet metal strips.