发明名称 |
Resin encapsulation type semiconductor device. |
摘要 |
There is presented a highly reliable resin encapsulation type semiconductor device excellent in humidity resistance as well as high temperature electrical characteristics. The specific feature consists in the epoxy resin composition employed for encapsulation. This composition comprises an epoxy resin, a novolac resin as curing agent and an organic phosphine compound as curing accelerator. The resin encapsulation tpe semiconductor device is markedly small in leak current under hot and humid conditions and has a prolonged life due to difficult deterioration through corrosion of electrodes and aluminum wiring, as compared with those of prior art. |
申请公布号 |
EP0041662(A1) |
申请公布日期 |
1981.12.16 |
申请号 |
EP19810104126 |
申请日期 |
1981.05.29 |
申请人 |
TOKYO SHIBAURA DENKI KABUSHIKI KAISHA |
发明人 |
IKEYA, HIROTOSHI;SUZUKI, HIROTOSHI;OGUNI, TAKAYUKI;MATSUMOTO, KAZUTAKA;HATANAKA, AKIKO;WADA, MORIYASU |
分类号 |
C08G59/68;C08L63/00;H01L23/29;(IPC1-7):01L23/30;08G59/40;08G59/68 |
主分类号 |
C08G59/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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