| 摘要 |
PURPOSE: To enable coverlays to be peeled off and swelled on the surface of a flex part. CONSTITUTION: Conductor circuits (copper foils 12, 13) are provided on both surfaces of a base film 10 so as to laminate the first prepregs 14, 15 on both surfaces of the base film 10. Next, coverlays 21, 22 which may extend to through holes 42, 43 are provided on the aperture parts of the base film 10. At this time, the cover lays comprising polyimide base resin in the semicured state are arranged so as to covere the aperture parts to be thermal pressure fixed and laminated on the surface of the base film 10. Finally, the second prepregs 23, 24 having the other aperture parts 25, 26 in almost the same shape as that of the aperture parts of the first prepregs 14, 15 are laminated on the first prepregs 14, 15. |
