Semiconductor integrated circuit devices.

摘要

A semiconductor memory device has memory cells 2 and decoder circuitry 3 disposed centrally thereof. A ground line 7 min extends around the memory cells 2 and the decoder circuitry 3. Control circuits 41 to 46 are disposed beneath or outwardly of the ground line 7 min . Signal lines 5 min for connecting the control circuits to one another are disposed outwardly of the control circuits 41 to 46. A power line 6 min is in turn disposed outwardly of the signal lines 5 min . This layout can provide for a reduction in the number of bridges required.