| 摘要 |
PURPOSE:To maintain a semiconductor device in high reliability and to reduce the cost of the device by forming a pad formed on a pellet, the post of a lead and a wire connected thereto of aluminum and forming an alumite protective film on the surface of the aluminum. CONSTITUTION:A pellet 3 is fixed on the upper surface of a tab of a lead frame 1 with solder 4, an insulating film 5 is formed on the surface of the pellet 3, and an aluminum pad 6 is formed on the film 5. An oxidized silicon film 7 is formed on the surface of the pellet except the pad 6, a post made of aluminum film 9 is formed on the inner lead 8 of the lead frame 1, and the pad 6 is electrically connected via an aluminum wire 10 to the post 9. Thereafter, they are inserted into the heated atmosphere, high temperature steam is injected into the atmosphere, and a protective film of alumite is formed on the aluminum. Thus, the aluminum part can be improved in the moisture resistance, and can be improved in the reliability inexpensively. |
