| 摘要 |
<p>PURPOSE:To divide a semiconductor crystalline wafer into chips without occurrence of cracks or the like by applying a load to the wafer by forming V-shaped strip grooves at a predetermined interval on the wafer and fixing a cutting plate provided with wedge-shaped strip projections at the same interval as the grooves onto the wafer. CONSTITUTION:V-shaped strip grooves 15 are formed on one crystalline surface 11 of a semiconductor crystalline wafer 14, and V-shaped strip grooves 16 are so formed as to perpendicularly cross the grooves 15 on the other crystalline surface 12. The wafer 14 is disposed on an elastic plate 18 such as a rubber plate or the like, and a cutting plate 19 having wedge projections 20 is superposed on the wafer. At this time, it is adjusted that the position of the projections 20 is matched to that of the grooves 16. When a cylindrical weight applying member 21 is then pressed onto the plate 19 while being rotated, the wafer 14 is cleaved by the grooves 16 and is divided into individual chips. Since unreasonable load is not applied to the wafer, it can suppress the occurrence of cracks or the like at the wafer.</p> |
