| 摘要 |
PURPOSE:To enhance the property for general purpose of the printing device by a method wherein an exposure mode selecting switch and a means to make the relative position between a mask and a wafer to be differed every time of exposure for the prescribed quantity and to set the sum of the quantity of respective exposure at the desired value are provided. CONSTITUTION:In the device to form the mask pattern on the wafer for manufacture of a semiconductor circuit element and to print the pattern on the wafer, a switch to slect one time exposure mode and plural times exposure mode is provided. When plural times exposure mode is to be performed, the relative positinal relation between the mask pattern and the wafer is made to be differed every time exposure for the prescribed quantity, and the sum of exposing quantity of respective exposure is made to larger than the quantity of exposure when one time exposure is to be performed. Accordingly the property for general purpose of the printing device is enhanced together with the resolution of pattern. |
