| 摘要 |
PURPOSE:To enhance the resolution of the device by a method wherein a means to detect the relative slip quantity between a mask and a wafer by positioning marks provided on both and to make both to align, and a means to make the relative position of both to slip according to the positioning marks when plural times exposure are to be performed are provided. CONSTITUTION:In the device to form the mask pattern on the wafer for manufacture of a semiconductor circuit element and to print the pattern on the wafer, the relative slip quantity between the positioning marks 90 provided at the circumference of the mask and the positioning marks 95 provided at the circumference of the wafer is detected, and one of both is made to be transferred to make both to align. When plural times exposure are to be performed, the relative positional relation of both is made to differ for the prescribed quantity reading the positioning marks after respective exposure, and then next exposure is performed. Accordingly alignment and transfere of the mask and the wafer can be performed precisely, and the resolution of pattern is enhanced. |
