| 摘要 |
PURPOSE:To perform a stabilized and highly reliable bonding as well as to contrive to miniaturize the subject mounting structure by a method wherein a solder bump and the solder resist as a spacer are provided on a circuit substrate and a bonding work is performed on an IC chip. CONSTITUTION:On the circuit substrate 7, four solder resists 11a consisting of photoresistive dry film are provided in such manner that a uniform thickness is given to the resists, the height of the bump is controlled and also the solder bump 9 is accurately positioned facing a pattern 14. On the solder resists 11a, the IC chip 8 is placed, fused by heating and a bonding work is performed. Through these procedures, the variation in the height of the bump is eliminated, while a highly reliable and stabilized bonding is performed and also the mounting structure can be miniaturized. |
