| 摘要 |
PURPOSE:To enhance the property for general purpose of the printing device by a method wherein an exposure mode selecting switch, a means to make the relative position between a mask and a wafer to differ every time exposure for the prescribed quantity and a wafer discharging mechanism in accordance with the exposed pattern are provided in the pattern printing device. CONSTITUTION:In the device to form the mask pattern on the wafer for manufacture of a semiconductor circuit element and to print the pattern thereof to the wafer, a switch to select one time exposure mode and plural times exposure mode is provided. A device is provided to discharge the wafer after one time exposure is performed when one time exposure mode is selected, and when plural times exposure mode is selected, to make the relative position between the mask pattern and the wafter to be differed every time exposure and to discharge the wafer after plural times exposure is performed. Accordingly the property for general purpose of the printing device is enhanced, together with the resolution of pattern. |
