Verfahren zur Herstellung einer mehrschichtigen Mikrowellenplatte und so erhaltene Platte

摘要

Method for manufacturing a multilayer microwave board in one operation. Individually etched layers (2,3,5,6) of a laminate (1,4,10,12), such as duroid, are bonded to form a package and drilled after which the resulting holes (9) are plated. Next, the superfluous connections (15,16) are removed by drilling during which process each stripline-coax transition buried in the package is tuned by a correct selection of the drill diameter and the hole depth.