| 摘要 |
PURPOSE:To enable the brazing without a bend of a laminated body by a method wherein melting points of a material used for for brazing for forming the laminated body of semiconductor plates and that for bonding a connecting conductor are different. CONSTITUTION:The semiconductor plates 1 having P-N junctions are laminated with braze plates 12 interposed and brazing is performed by raising the temperature. Then, the brazed laminated silicon plates are cut into small cubes to obtain a columnar laminated body 6. A braze plate 15 made of braze with a melting point lower than a solder layer 2 formed of the solder plates 12 is mounted on the end surface of the columnar laminated body 6. Subsequently, an end surface 7 at the head 4 of a lead wire 3 is put on top the braze plate 15 with the low melting point and brazed by raising the temperature as high as only the braze plate 15 with the low melting point is melted. At this time, the solder of the brazed layer 2 is not melted and the brazing can be conducted without bending the laminated body 6. |
